Product Application Engineer Xilinx Technical Support Loading Application. Thermal analysis software : 6SigmaET . GTH transceivers in A784, A676, and A900 packages support data rates up to 12. UltraScale FPGA BPI Configuration and Flash Programming. 18) April 22, 2022 Chapter 4: Mechanical Drawings UBVA368 Flip-Chip, Fine-Pitch BGA (XCAU10P and XCAU15P) X-Ref Target - Figure 4-1 Figure 4-1: Package Dimensions for UBVA368 (XCAU10P and. Like Liked Unlike Reply. UG575 (v1. • If all of the Quads in a power supply group are not used, the associated power pins can be left unconnected or tied to GND (unless the RCAL circuit is in that Quad). com. . The Radeon Pro 575 is a professional mobile graphics chip by AMD, launched on June 5th, 2017. 8mm ball pitch. - GitLab. ThanksLoading Application. Select search scope, currently: catalog all catalog, articles, website, & more in one search; catalog books, media & more in the Stanford Libraries' collections; articles+ journal articles & other e-resourcesThese pinout files can be downloaded using links found in Chapter 2 of UG575. The Thermal model should be out soon too. GTH transceivers in A784, A676, and A900 packages support data rates up to 12. Loading Application. 302 p. Whether you are designing a state-of-the art, high-performance networking application requiring the highest capacity, bandwidth, and performance, or looking for a low-cost, small footprint FPGA to take your software-defined technology to. It seems the value for M is too high (UG575, table 8-1). Resources Developer Site; Xilinx Wiki; Xilinx GithubPlease refer page 328 of UG575 (v1. Built on the 14 nm process, and based on the Ellesmere graphics processor, in its Ellesmere XLA variant, the chip supports DirectX 12. UltraScale Device Packaging and Pinouts UG575 (v1. only drawing a few watts. 5Gb/s. 1 and vivado2015. Offering up to 20 M ASIC gates capacity. I see the package in ug575. In the UltraScale+ Devices Integrated Block for PCI Express v1. ) along with any thermal resistances or power draw numbers you may have. Note: The zip file includes ASCII package files in TXT format and in CSV format. 2. GTH bank location errors. Resources Developer Site; Xilinx Wiki; Xilinx GithubLoading Application. UG570 UltraScale Architecture Configuration UG575 UltraScale and UltraScale+ FPGAs Packaging and Pinouts UG571 UltraScale Architecture SelectIO UG576 UltraScale Architecture GTH Transceivers UG572 UltraScale Architecture Clocking Resources UG579 UltraScale Architecture DSP SliceFrom UG575, we know how to put the pins in continuous 3 banks, but there's no column information for each bank. // Documentation Portal . GC inputs can connect to the PHY adjacent to the. G576 explains how to select the reference clock (see page 32). I'm using the KU060 in a relatively low power design. Information on pin locations for each. UltraScale Architecture Migration Table Footprint Artix® UltraScale+™ Kintex® UltraScale™ Kintex UltraScale+ Virtex® UltraScale Virtex UltraScale+ AU7P AU10P AU15P AU20P AU25P KU025 KU035 KU040 KU060 KU085 KU095 KU115 KU3P KU5P KU9P KU11P KU13P KU15P VU065 VU080 VU095 VU125 VU160 VU190 VU440 VU3P VU5P VU7P. XDC file shows that C0_SYS_CLK_clk_p and C0_SYS_CLK_clk_n are connected to FPGA pins H22 and H23. Dragonboard is ideal in floor applications where non combustibility and resistance to abuse, termites. The following is a description for how to modify the pinouts for different devices. // Documentation Portal . Resources Developer Site; Xilinx Wiki; Xilinx GithubUG575 (v1. 1. @Ralf_Leef_l8 For Mechanical Drawing, a new version of UG575 is expected to be out soon and will have the details for VU23P. // Documentation Portal . I think the last FPGA to have an other-than-BGA package was the Spartan-6 - see the TQG144 quad-flat-pack package in UG385. Footprint compatibility means that nothing catastrophic will happen (eg. UG575 (v1. There are Four HP Bank. 2 version. Description: Extended/Direct Handle Motor Disconnect Switch. I've read the thermal section in UG575, but I don't have the capability or know-how to perform thermal modeling. The AMD DDR4 core can generate a full controller or phy only for custom controller needs. All other packages listed 1mm ball pitch. 12) to determine available IOSTANDARDs. 1) September 14, 2021 11/24/2015 1. Viewer • AMD Adaptive Computing Documentation Portal. Expand Post. This site uses cookies from us and our partners to make your browsing experience more efficient, relevant, convenient and personal. Artix UltraScale+ FPGAs are the industry’s only FPGA available in Integrated Fan-Out (InFO) for small form factor packaging. UltraScale Architecture GTY Transceivers 4 UG578 (v1. PL 读写 PS 端 DDR 数据 20. In some cases, they are essential to making the site work properly. I'm using the KU060 in a relatively low power design. Expand Post. Bank Diagram is in the UG575 regarding the XCAU25P-FFVB784. hello, Regarding soldering of the XCKU060-2FFVA1517E (used in one of our projects): ug1099 (v1. . Summary of Topics. Thanks, Sam// Documentation Portal . + Log in to add your community review. Aurora Lane locations. I always wondered where I can find the physical location of every single resource of an FPGA. Hi, We see that UG575 mentions the BGA nominal dia of 0. junction, case, ambient, etc. Loading Application. I always wondered where I can find the physical location of every single resource of an FPGA. Generic IOD Interface Implementation. 3 is not available yet and. 9. I believe this is the correct drawing of the deminsions. UG575, UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification UG576, UltraScale Architecture GTH Transceivers User Guide UG578, UltraScale Architecture GTY Transceivers User Guide UG579, UltraScale Architecture DSP Slice User Guide UG580, UltraScale Architecture System Monitor User Guide2. Expand Post. FPGA Bank Columns. The following table lists the device, number of pins, part number, silicon type, package type, and downloadable package drawing for the devices. What is the meaning of this table？. I am looking for the diagram for ultrascale+ Artix FPGAs. control with soft and hard engines for graphics, video, waveform, and packet processing. No - although some would refer you to the GSR (Global Set/Reset) pin of the STARTUPE3 primitive - see page 118 of UG570(v1. Thermal. RF & DFE. So if you look at the package overview section in UG575 you see the conceptual diagram of each VUP device. All Answers. Programmable Logic, I/O and Packaging. GTH transceivers in A784, A676, and A900 packages support data rates up to 12. It seems the value for M is too high (UG575, table 8-1). // Documentation Portal . Hello, I am currently designing a heatsink solution (heatsink + thermal pad) for a FPGA Ultrascale with a lidless package (XCKU035 FBVA900). Loading Application. Not your flight? SWG575 flight schedule. If the IO pin is in a HD bank, then use the VCCO value and Tables 3-1 and 3-2 in UG571(v1. . We see that UG575 mentions the BGA nominal dia of 0. Loading Application. // Documentation Portal . If the IO pin is in a HD bank, then use the VCCO value and Tables 3-1 and 3-2 in UG571(v1. UltraScale Architecture SelectIO Resources 6 UG571 (v1. (see figure below). Hello I want to used xcvu440-blgb2377-1-c by vivado 2015. また、XCVU440 バンクに対して NativePkg. PROGRAMMABLE LOGIC, I/O AND PACKAGING. I've read the thermal section in UG575, but I don't have the capability or know-how to perform thermal modeling. Device : xcku085 flva1517 vivado version: 2018. DCI cascading - allows cascading the VRP node for multiple IO banks on the same IO Bank Column, so that only one VRP pin is connected to a precision resistor (UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification (UG575)). This helps to achieve timing closure of the design. My specific concern is the height from the seating plane (dimension A). Hi @andremsrem2,. Hello, I'm looking through the Zync Ultrascale+ datasheet and I can't find where it lists which banks are HR and which are HP and in the IP Planner it only shows High Density andLooking through the Package and Pinout guides for 7-Series (UG475) and UltraScale (UG575), I find that all packages are BGA. Gas and Vapor Detectors and Sensors. 8. If so, could any pin act as a synchronized reset input? Open, closed, and transaction based pre-charge controller policy. But there is no PSG RN listed for this package in Figure 1-16 in UG575 (the one I attached above). VCU118 UserGuide (UG1224) tells me that the QSFP1 slot is connected to 4 GTY transceivers on Quad 231. pdf · adba5616e0bc482c1dc162123773ced75670d679. Product Application Engineer Xilinx Technical SupportLoading Application. 75Gbps. Resources Developer Site; Xilinx Wiki; Xilinx Github@229853eikganrho (Member) . Solution. Product Specification (UG575) . G3 F54 1993 The Physical Object Pagination 2 v. Ultrascale+ Packaging & Pinouts (UG575) tells me that there is in fact a Quad 231 on the right side of the device. Zynq® UltraScale+ devices provide 64-bit processor scalability while combining real-time. Resources Developer Site; Xilinx Wiki; Xilinx GithubLTM4644/LTM4644-1 1 Re For more information n Quad Output Step-Down µModule® Regulator with 4A per Output n Wide Input Voltage Range: 4V to 14V n 2. 18) April 22, 2022 Chapter 4: Mechanical Drawings UBVA368 Flip-Chip, Fine-Pitch BGA (XCAU10P and XCAU15P) X-Ref Target - Figure 4-1 Figure 4-1: Package Dimensions for UBVA368 (XCAU10P and XCAU15P) ug575_ch5_030122 Send Feedback MSL is a number between 1 and 7. Expand Post. デバイス資料 (ザイリンクス) 『Zynq-7000 SoC テクニカル リファレンス マニュアル』 (UG585) は、Zynq SoC のアーキテクチャ、機能、および制御およびステータス レジスタの詳細な説明を含む総合的なユーザー ガイド (1700ページ以上) です。. For a quick estimate you can look at bank numbers, usually they are consecutive for the same column with a gap between columns but there is no number gap for the SLR split. 0) and UG575 (v1. 7 µF ±10% • For optimal performance, power supply noise must be less than 10 mVpp. For Zynq UltraScale (as shown by ashishd), see UG1075. UltraScale Architecture Configuration User Guide UG570 (v1. UG575 (v1. 7. // Documentation Portal . VIVADO. 64 x GTY high speed. 3 IP name: IBERT Ultrascale GTH version: 1. 61903. A single PCIe4 Integrated Block is capable of Gen3x16, but this requires 4 adjacent GT Quads. Like Liked Unlike Reply. // Documentation Portal . Dragonboard is ideal in floor applications where non combustibility and resistance to. Programmable Logic, I/O and Packaging. I suppose the XCAU25P is the same as XCKU3P, so please refer to the KU3P in the xlxs. After I changed to dedicated ports for GT's reference clock and things are right. Publication Date. The island. The. Date V ersion Revision. AMD Virtex UltraScale+ XCVU13P. Like Liked Unlike Reply. . 46 [get_ports SYSCLK_P]Hi team, Would like to confirm if package type of MPN: XC6VLX240T-2FFG1156C belongs to FFVA1156? Thanks. If the IO pin is in a HP. All banks in the same SLR and column in those diagrams are in the same "I/O bank column". XCKU060-2FFVA1517E soldering. We would like to show you a description here but the site won’t allow us. UG475 is a user guide that provides detailed information on the pinout and package specifications of the 7 series FPGAs from Xilinx. このユーザー ガイ. In the ZYNQ instance inside IPI, the IRQ_F2P bus cannot be changed from [0:0] even though the documentation states it's a 16 bit bus. 8mm ball pitch. 7. Note: The zip file includes ASCII package files in TXT format and in CSV format. Dragonboard Magnesium Oxide Board (MgO) is a lightweight alternative to poured concrete. Loading. The screenshot you provided of your . The table shows that the KU11P has 4 PCIe4 Integrated Blocks. Use the schematics for your FPGA board to find the voltage, VCCO, for the bank that contains the IO pin. 12) March 20, 2019 x. 3. Loading Application. Regards, Deepak D N-----Please Reply or Give Kudos or Mark it as a Accepted Solution. See UG575, UltraScale Architecture Packaging and Pinouts User Guide for more information. 3. デバイス資料 (ザイリンクス) 『Zynq-7000 SoC テクニカル リファレンス マニュアル』 (UG585) は、Zynq SoC のアーキテクチャ、機能、および制御およびステータス レジスタの詳細な説明を含む総合的なユーザー ガイド (1700ページ以上) です。. 官方不直接提供器件的原理图和pcb库，需要参考ug575自己建库。 如果是使用AD软件，可以去AD官网看一下，他们好像提供xilinx器件的库。 Expand PostHi, I'm planning to use a XCKU060 in FFVA1517 package and I have a question regarding the following statement: "If all of the Quads in a power supply group are not used, the assocHi I am trying to make a hardware design with ultrascale xcku035-ffva1156 FPGA. 03/20/2019 1. 6 で、正しい座標情報が含まれるようになる予定です。Hi, We will use Virtex Ultra+ FPGA (XCVU13P-2FLGA2577E) in our project. All banks in the same SLR and column in those diagrams are in the same "I/O bank column". Therefore, it remains a challenge for Xilinx to predict the power requirements of a given FPGA when it leaves the factory. Resources Developer Site; Xilinx Wiki; Xilinx Github 注 : zip ファイルには、txt および csv 形式の ascii パッケージ ファイルが含まれます。このファイル形式は、ug575 で説明されています。 Note: The zip file includes ASCII package files in TXT format and in CSV format. Virtex UltraScale+ FPGA Data Sheet: DC and AC Switching Characteristics DS923 (v1. 54 MB. OLB) files? Are these (. 6. 6). I'll use the 1156 package as a reference since that's on the ZCU102 design. 8. 4 were incorrect. The most useful chapters for you will be chapter. (on time) Saturday 13-May-2023 12:13PM MST. ) Go ASCII Pinout Files chapter in this Device Packaging and Pinouts guide. A very similar package (FFVA1156) which I found in the document UG575 has three different heights listed for different parts (Figures 4-12, 4-13 and 4-14), so I'm not sure if the listed nominal height (A=3. My specific concern is the height from the seating plane (dimension A). Resources Developer Site; Xilinx Wiki; Xilinx GithubReferring to ug575 is a good place to check the relative location of PCIe hardblock and the GT quads. This chapter provides an overview of clocking and a comparison between clocking in the UltraScale architecture and previous FPGA. Share. <p></p><p. . Those were working good and also the marking is very light and difficult to read ( Laser marking- I suppose) I am attaching the photo of the device. However, when I open the synthesized design I do not see the expected I/O PACKAGE_PIN locations of the GTYs as defined by the UltraScale and UltraScale+ Packaging and Pinouts Guide (UG575). How DragonBoard is Made. e. seamusbleu (Member) 2 years ago **BEST SOLUTION** Check out UG575. Selected as Best Selected as Best Like Liked Unlike 1 like. Expand Post. One way to answer questions like this is to refer to the “Packaging and Pinouts” user guide for your series of FPGAs. I suppose the XCAU25P is the same as XCKU3P, so please refer to the KU3P in the xlxs. You don't even need to open Vivado to get this information, it is available in text format in the User Guides. R evision His t ory. We would like to show you a description here but the site won’t allow us. 0 5. KeithThese pinout files can be downloaded using links found in Chapter 2 of UG575. Please confirm. proFPGA with AMD Virtex UltraScale+ XCVU13P FPGA. Where could I find which banks are in same column? Thanks . Hello, I am using the Zynq Ultrascale\+ MPSoC part #XCZU19EG-2FFVE1924I and looking on page 378 of the UltraScale Device Packaging and Pinouts UG575 (v1. I'm using the KU060 in a relatively low power design. Specified as each individual output channel at TA = 25°C, VIN1 = VIN2 = 12V, unless otherwise noted per the typical application shown in. co. From the graphics in UG575 page 224 I would say 650/52. Loading. 03/20/2019 1. The format of this file is described in UG1075. Up to 1. When used as regular I/O, global clock input pins can be configured as any single-ended or differential I/O standard. 11). . IP AND. I/O Features and Implementation. As you say, the STARTUPE3 is needed to access the CCLK output of the FPGA, which connects to both flash devices. URL Name. 0) and UG575 (v1. 7. 1) besides, there are some warning messages showed below: WARNING: [Xicom 50-38. Interface calibration and training information available through the Vivado hardware manager. Resources Developer Site; Xilinx Wiki; Xilinx Github Bank Diagram is in the UG575 regarding the XCAU25P-FFVB784. 12) March 20, 2019 Chapter 1: Pack aging Overview Zynq® UltraScale+ MPSoC devices provide 64-bit processor scalability while combining UG575, UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification UG576, UltraScale Architecture GTH Transceivers User Guide UG578, UltraScale Architecture GTY Transceivers User Guide UG579, UltraScale Architecture DSP Slice User Guide UG580, UltraScale Architecture System Monitor User Guide UltraScale Architecture GTH Transceivers 6 UG576 (v1. Regards, TC. Resources Developer Site; Xilinx Wiki; Xilinx Github; Support Support CommunityUltraScale Architecture GTH Transceivers 6 UG576 (v1. I was able to access the configuration flash via my custom spi-controller with a XC7VX485T and some 7series Artix devices. The information is available in UG575 (Ultrascale and Ultrascale+ FPGAs Packaging and Pinouts) document. We are referring to UG575, in which Bank Diagram does represent the SYSMON, however, the Block numbers (e. I want to use 5 DDR4 component memories (x16 type) and i need to connect them to 3 HP banks (44,45**BEST SOLUTION** Hello @rmirosanros5, These behaviors are hard coded when the IP Is generated. // Documentation Portal . Is it an older revision I have now or? Can you send me a link? ThanksDSP IP & TOOLS. 12) helps us. Community Reviews (0) Feedback? No community reviews have been submitted for this work. UG575, p. I have scrapped some I/O pinout configurations from here but I. 12) March 20, 2019 Chapter 1: Pack aging Overview Zynq® UltraScale+ MPSoC devices provide 64-bit processor scalability while combiningUG575, UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification UG576, UltraScale Architecture GTH Transceivers User Guide UG578, UltraScale. Loading Application. POWER & POWER TOOLS. Thank you! Look at the Device Diagrams section of UG575 (Packaging and Pinouts) for your device. GitLab. Using the buttons below, you can accept cookies, refuse cookies, or change. 10. com耐湿レベル (MSL) に関する情報 (JEDEC J-STD-020 仕様より) MSL は 1 ～ 7 の数値です。. Now, for PCIe Gen3 x8 Interface on VU9P for X1Y2 PCIe Block, the GT Locations are X1Y35-X1Y28 (as per PG213 v1. For example if you want to find the pin planning information for UltraScale / UltraScale+ devices go. Child care and day care. // Documentation Portal . Could you please provide the datasheet or specs for the maximum operating temperature (i. 2. 2 12 13. Best regards, Kshimizu. // Documentation Portal . UG575, UG1075. I further looked at the Packaging and Pinout document UG575 (v1. Hello, I am. PROGRAMMABLE LOGIC, I/O AND PACKAGING. 27). Is the 6mil shown here a mistake?PCIe Reset on VU11P on bank 65. Are they marked in ug575-ultrascale-pkg-pinout. For UltraScale parts you can find the info in UG575 packaging and pinouts. Flexible via high-speed interconnection boards or cables. Best regards, Kshimizu . UG575 (v1. Expand Post. AMD offers a comprehensive multi-node portfolio to address requirements across a wide set of applications. 4. To provide specific guidance d**BEST SOLUTION** Hi @dragonl2000lerl3,. For UltraScale and UltraScale+, see UG575. Programmable Logic, I/O and Packaging Programmable Logic, I/O & Boot/Configuration Kintex UltraScale Knowledge. // Documentation Portal . Also, when I try to create a bus with less than 2 bytes worth of bits, I see many LVDS pair hidden from the drop down. 4 Added configuration information for the KU025 device. UG575 (v1. Device : xcku085 flva1517 vivado version: 2018. Like Liked Unlike Reply. Also, I am looking for the maximum allowable junction temperature. For example, Bank 68, 13-bit wide bus excludes the option to use A14/B14. Hi @andremsrem2,. 您好！最近使用Ultra Scale FPGA的Transceiver，从官网获取一份资料KCU105的mipi d-phy的实现，相关文档是xapp1399！vivado版本是2018. 2 Note: Table, figure, and page numbers were accurate for the 1. Table 1-5 in UG575(v1. I use SMBALERT as an indicator signal on my board, and in some cases, I have noticed that during FPGA startup, where the SMBALERT signal is pull. Up to 1. May 7, 2018 at 4:42 AM. Resources Developer Site; Xilinx Wiki; Xilinx GithubLoading Application. DMA 使用之 ADC 示波器 (AN9238) 25. 焊接温度如下：100 120 140 160 180 200 235 260，对应的持续时间为：40 40 40 50 50 50 50 40。 查看了UG575的 Soldering Guidelines ，是不是200°以上持续时间偏长（140s），要求是60–150s；且不应该是260度（文档上要求为FFVA1156，Mass reflow:245°）焊接引起的。Ultra-Compact Packaging. There are Four HP Bank. Loading Application. Related Questions. GTH transceivers in A784, A676, and A900 packages support data rates up to 12. 0. Search the PIN number in this file. . All banks in the same SLR and column in those diagrams are in the same "I/O bank column". UG575 suggested to use external shunt resistor for proper operation, But Si5391 PLL circuit recommendation mentioned that Shunt resistors to ground or series resistors should NOT be added. The controller will run up to 2400Mbps in UltraScale and 2667Mbps in UltraScale+. Zero Ohm Jumper TopLine Corporation 95 Highway 22 W Milledgeville, GA 31061, USA Toll Free USA/Canada (800) 776-9888 International: 1-478-451-5000 • Fax: 1-478-451-3000 Email: [email protected]) Configuration Memory QSPI 2GBit Flash Memory Configuration Modes From onboard Flash Through USB board management (built-in JTAG) Partial Reconfiguration (via MCAP) Over PCIE Deliverables ADM-PCIE-9V5 Board One Year Warranty One Year Technical Support@joe306 Yes, Page#198 from UG1075 v1. You can find that GT quad which is placed in the middle of the SLR is not supported with any PCIe blocks in the device. Viewer • AMD Adaptive Computing Documentation Portal. Multiple integrated PCI Express ® Gen3 cores. You can contact the company at 0772 958281. Standard 2075, Edition 2 Edition Date: March 05, 2013 ANSI Approved: August 04, 2023 USD. com 注 : zip ファイルには、txt および csv 形式の ascii パッケージ ファイルが含まれます。このファイル形式は、 ug575 で説明されています。 This web page provides the pinout files for the UltraScale and UltraScale+ packages, which are used in Xilinx FPGA devices. Let's first clarify things for the transceivers location and clock source selection: UG575 shows the bank diagrams which for your device looks as follows:. I have attached a link to UG575, which will give you an idea on how to design the thermal management system for your part. Are they marked in ug575-ultrascale-pkg-pinout. Symbol Description 1, UltraScale Architecture Configuration User Guide UG570 (v1. Why?Hi, I am working on a Zynq Ultrascale+ MPSoC ZCU102 Evaluation Kit using Vivado I am trying to do a simple test project where I have an IP and I want to connect some of its pins to Switches and LEDs but I just cannot find a table describing which pins I have to assign my external signals to. From the graphics in UG575 page 224 I would say 650/52. Hi guys, I am trying to replicate the Aurora Simplex Example Design on KCU105 dev board. OLB) files for the schematic design. The package file for this FPGA (ref ug575) shows that these pins are in the FPGA bank 45 and are I/O type HP. -----Expand Post. UG575 adalah bandar slot teraman dengan bonus deposit, freebet / freechip tanpa deposit, promo anti rungkat, bonus rebate mingguan, bonus member baru, deposit pulsa tanpa potongan, perfect attendant (absensi mingguan), bonus referral, bonus happy hour, extra bonus TO (TurnOver) bulanan, cashback mingguan, winrate tertinggi, proses. Zynq™ 7000 SoC Package Files. 6. It seems the value for M is too high (UG575, table 8-1). payload":{"allShortcutsEnabled":false,"fileTree":{"Datasheet/XILINX":{"items":[{"name":"ds180_7Series_Overview. 8 We would like to show you a description here but the site won’t allow us. In some cases, they are essential to making the site work properly. UG575 (v1. Bee (Customer) 7 months ago. DMA 环通测试 22. DragonBoard USA Announces Update to UL Floor and Ceiling Assembly G575. 59 views. UG575 (v1. Ex. The similar Bank is the XCKU3P-SFVB784/FFVD900, too. **BEST SOLUTION** Hello @rmirosanros5, These behaviors are hard coded when the IP Is generated. Download as Excel. We would like to show you a description here but the site won’t allow us. Loading Application. Resources Developer Site; Xilinx Wiki; Xilinx Github; Support Support CommunityHi, We will use Virtex Ultra+ FPGA (XCVU13P-2FLGA2577E) in our project. (XAPP1282)6. Starting GT Lane e. 7. UG575 gives only an very high level map. . This intervention is a priority need, and is in line with the Compassion International-Uganda’s strategy to enhance child attainment of programmatic outcomes through infrastructure. Log In to Answer. We would like to show you a description here but the site won’t allow us. IOD Features and User Modes. All other packages liste d 1mm ball pitch. 1.